Invention Grant
- Patent Title: Circuit board, and semiconductor device having component mounted on circuit board
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Application No.: US14554334Application Date: 2014-11-26
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Publication No.: US09351402B2Publication Date: 2016-05-24
- Inventor: Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2009-251269 20091030; JP2009-251378 20091030; JP2009-253130 20091104; JP2009-253501 20091104; JP2009-253502 20091104
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H01L21/48 ; H01L23/498 ; H05K3/10 ; H05K3/18 ; H05K3/38 ; H01L23/00

Abstract:
A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.
Public/Granted literature
- US20150156873A1 CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD Public/Granted day:2015-06-04
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