A system for manufacturing an industrial automation drive includes a carrier frame configured to hold one or more semiconductor devices for use in the industrial automation drive. The carrier frame includes a set of fasteners disposed around an internal wall of the carrier frame such that each fastener of the set of fasteners includes an angled edge and a horizontal edge. Each fastener of the set of fasteners is configured to toollessly couple a power circuit board having the semiconductor devices to the carrier frame by bending from a first position when the power circuit board is pushed against the angled edge and returning to the first position when the power circuit board is pushed past the horizontal edge.