公开(公告)号：US20130120946A1

公开(公告)日：2013-05-16

申请号：US13664269

申请日：2012-10-30

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Doyle F. Busse ,  Kevin G. Stachowiak ,  Kevin L. Baumann ,  Raymond G. Sladky ,  Gary R. Krenke ,  John C. Boetcher ,  Brian R. Krueger ,  Robert M. Michalski ,  Paul J. Grosskreuz ,  Joseph William Budill ,  Brian C. Frank ,  Martha A. Maxwell

IPC: H05K7/14

CPC classification number: H05K7/1432 ,  H05K7/1471 ,  Y10T29/49947

Abstract: A system for manufacturing an industrial automation drive includes a carrier frame configured to hold one or more semiconductor devices for use in the industrial automation drive. The carrier frame includes a set of fasteners disposed around an internal wall of the carrier frame such that each fastener of the set of fasteners includes an angled edge and a horizontal edge. Each fastener of the set of fasteners is configured to toollessly couple a power circuit board having the semiconductor devices to the carrier frame by bending from a first position when the power circuit board is pushed against the angled edge and returning to the first position when the power circuit board is pushed past the horizontal edge.

Abstract translation: 用于制造工业自动化驱动器的系统包括被配置为保持用于工业自动化驱动中的一个或多个半导体器件的载体框架。 承载框架包括围绕承载框架的内壁设置的一组紧固件，使得该组紧固件中的每个紧固件包括成角度的边缘和水平边缘。 所述一组紧固件中的每个紧固件构造成当电力电路板被推靠在成角度的边缘上时，通过从第一位置弯曲而将具有半导体器件的电力电路板无缝地耦合到承载架，并且当电力 电路板被推过水平边缘。

公开(公告)号：US09351420B2

公开(公告)日：2016-05-24

申请号：US13664269

申请日：2012-10-30

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Doyle F. Busse ,  Kevin G. Stachowiak ,  Kevin L. Baumann ,  Raymond G. Sladky ,  Gary R. Krenke ,  John C. Boetcher ,  Brian R. Krueger ,  Robert M. Michalski ,  Paul J. Grosskreuz ,  Joseph William Budill ,  Brian C. Frank ,  Martha A. Maxwell

IPC: H05K7/00 ,  H05K7/14

CPC classification number: H05K7/1432 ,  H05K7/1471 ,  Y10T29/49947

Abstract: A system for manufacturing an industrial automation drive includes a carrier frame configured to hold one or more semiconductor devices for use in the industrial automation drive. The carrier frame includes a set of fasteners disposed around an internal wall of the carrier frame such that each fastener of the set of fasteners includes an angled edge and a horizontal edge. Each fastener of the set of fasteners is configured to toollessly couple a power circuit board having the semiconductor devices to the carrier frame by bending from a first position when the power circuit board is pushed against the angled edge and returning to the first position when the power circuit board is pushed past the horizontal edge.

Abstract translation: 用于制造工业自动化驱动器的系统包括被配置为保持用于工业自动化驱动中的一个或多个半导体器件的载体框架。 承载框架包括围绕承载框架的内壁设置的一组紧固件，使得该组紧固件中的每个紧固件包括成角度的边缘和水平边缘。 所述一组紧固件中的每个紧固件构造成当电力电路板被推靠在成角度的边缘上时，通过从第一位置弯曲而将具有半导体器件的电力电路板无缝地耦合到承载架，并且当电力 电路板被推过水平边缘。