Invention Grant
- Patent Title: Systems, devices, and methods for electrically coupling terminals to electrodes of electrical stimulation systems
- Patent Title (中): 用于将端子电耦合到电刺激系统的电极的系统,装置和方法
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Application No.: US12545264Application Date: 2009-08-21
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Publication No.: US09351655B2Publication Date: 2016-05-31
- Inventor: Matthew Lee McDonald , Anne Margaret Pianca , John Michael Barker , Aditya Vasudeo Pandit
- Applicant: Matthew Lee McDonald , Anne Margaret Pianca , John Michael Barker , Aditya Vasudeo Pandit
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Lowe Graham Jones PLLC
- Agent Bruce E. Black
- Main IPC: A61B5/042
- IPC: A61B5/042 ; A61N1/05 ; H01R24/58 ; H01R13/52 ; H01R107/00

Abstract:
An implantable lead includes a first lead assembly with a distal tip and a medial end, a medial section with a first end and a second end, and a first intermediate assembly disposed between the first lead assembly and the first end of the medial section. The first lead assembly includes a plurality of external contacts and at least one conductive wire disposed in the first lead assembly. The at least one conductive wire extends from at least one external contact towards the medial end of the first lead assembly. The medial section includes a plurality of conductors extending from the first end to the second end. The first intermediate assembly includes a plurality of conductive elements. At least one of the conductive elements is configured and arranged to electrically couple the at least one conductive wire to at least one of the conductors.
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