Invention Grant
- Patent Title: Method and apparatus for removing organic materials
- Patent Title (中): 去除有机材料的方法和装置
-
Application No.: US13874595Application Date: 2013-05-01
-
Publication No.: US09352364B2Publication Date: 2016-05-31
- Inventor: Jun-ho Lee , Seung-yeon Lee , Kang-hee Lee , Seon-ah Jin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2012-0099550 20120907
- Main IPC: B08B7/02
- IPC: B08B7/02 ; H01L21/02 ; B08B7/00

Abstract:
A method for removing organic materials includes providing a target object having the organic materials adsorbed thereon, and an adsorbent, into a space including a non-liquid medium therein; and separating the organic materials from the target object by applying ultrasound waves to the target object having the organic materials adsorbed thereon and the adsorbent in the space, and disposing the organic materials to the adsorbent.
Public/Granted literature
- US20140069456A1 METHOD AND APPARATUS FOR REMOVING ORGANIC MATERIALS Public/Granted day:2014-03-13
Information query
IPC分类: