A load-carrying active material assembly and a method of preparing such an active material assembly suitable for attachment to a movable component of a mechanism is described. The assembly includes a shape memory alloy (SMA) element, a connector adapted to engage the moveable component mechanically crimped to the SMA element, and a filler material disposed intermediate the connector and SMA element. The filler may be a solder or a polymer. Methods for appropriately distributing the filler material and for promoting good adhesion of the filler to the SMA element and the connector are described.