Invention Grant
- Patent Title: Highly-reliable micro-electromechanical system temperature sensor
- Patent Title (中): 高可靠性的微机电系统温度传感器
-
Application No.: US13936192Application Date: 2013-07-07
-
Publication No.: US09354125B2Publication Date: 2016-05-31
- Inventor: Dimitrios Peroulis , Lokesh Anilkumar Gupta , Andrew S. Kovacs , Amir Shahidi
- Applicant: Purdue Research Foundation
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agency: Wilmer Cutler Pickering Hale and Dorr LLP
- Main IPC: G01K7/34
- IPC: G01K7/34 ; G01K1/02 ; G01K13/08 ; G01P15/097 ; G01P15/11 ; G01H11/00 ; G01M13/04

Abstract:
A sensor arrangement for wirelessly measuring temperature and vibration is disclosed. The sensor arrangement includes a sensor element and a sensor coil affixed on the device. A readout coil is configured to be magnetically coupled to the sensor coil configured to energize the sensor coil with an energizing signal, configured to provide the natural frequency of the sensor element, the sensor coil, and the readout coil, and configured to provide amplitude modulations of the energizing signal, the amplitude modulations being induced by changes in the coupling factor of the readout coil and the sensor coil. An energizing circuit is configured to energize the readout coil with the energizing signal. A readout circuit is configured to store or display information regarding the natural frequency and the amplitude modulations.
Public/Granted literature
- US20140204976A1 Highly-Reliable Micro-Electromechanical System Temperature Sensor Public/Granted day:2014-07-24
Information query