Invention Grant
- Patent Title: Method for polishing photonic chips
- Patent Title (中): 抛光光子芯片的方法
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Application No.: US14790963Application Date: 2015-07-02
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Publication No.: US09354393B2Publication Date: 2016-05-31
- Inventor: Andrew T S Pomerene , Matthew A. Gregory
- Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Russell Ng PLLC
- Agent Antony P. Ng; Daniel J. Long
- Main IPC: G02B6/10
- IPC: G02B6/10 ; G02B6/13 ; G02B6/122 ; B24B9/06 ; B24B49/02 ; G02B6/12

Abstract:
A method for polishing photonic chips is described. A gauge is placed in a photonic chip adjacent to an edge to be polished. The gauge includes a set of bars of various lengths. The bar lengths can be progressively ordered from shortest to longest or vice versa. The photonic chip is then secured in a chip polishing jig to get ready for polishing. When the photonic chip is being polished, an operator can visually inspect the gauge by looking at the polishing edge to estimate a polishing depth in order to determine a stopping point for polishing. Once the stopping point has been reached, the polishing of the photonic chip can be stopped.
Public/Granted literature
- US20160004011A1 METHOD FOR POLISHING PHOTONIC CHIPS Public/Granted day:2016-01-07
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