公开(公告)号：US09354393B2

公开(公告)日：2016-05-31

申请号：US14790963

申请日：2015-07-02

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Andrew T S Pomerene ,  Matthew A. Gregory

IPC: G02B6/10 ,  G02B6/13 ,  G02B6/122 ,  B24B9/06 ,  B24B49/02 ,  G02B6/12

CPC classification number: G02B6/13 ,  B24B9/065 ,  B24B49/02 ,  G02B6/122 ,  G02B6/30 ,  G02B6/3608 ,  G02B2006/121 ,  G02B2006/12197

Abstract: A method for polishing photonic chips is described. A gauge is placed in a photonic chip adjacent to an edge to be polished. The gauge includes a set of bars of various lengths. The bar lengths can be progressively ordered from shortest to longest or vice versa. The photonic chip is then secured in a chip polishing jig to get ready for polishing. When the photonic chip is being polished, an operator can visually inspect the gauge by looking at the polishing edge to estimate a polishing depth in order to determine a stopping point for polishing. Once the stopping point has been reached, the polishing of the photonic chip can be stopped.

Abstract translation: 描述了抛光光子芯片的方法。 将量规放置在与要抛光的边缘相邻的光子芯片中。 量规包括一组不同长度的棒。 条形长度可以从最短到最长排序，反之亦然。 然后将光子芯片固定在芯片抛光夹具中以准备抛光。 当光子芯片被抛光时，操作者可以通过观察抛光边缘来目视检查量规来估计抛光深度，以便确定抛光的停止点。 一旦达到停止点，就可以停止抛光光子芯片。