Invention Grant
- Patent Title: Batch process fabrication of package-on-package microelectronic assemblies
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Application No.: US14953565Application Date: 2015-11-30
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Publication No.: US09356006B2Publication Date: 2016-05-31
- Inventor: Belgacem Haba , Ilyas Mohammed , Liang Wang
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L25/10 ; H01L25/00 ; H01L21/56
Abstract:
A microelectronic assembly can be made by joining first and second subassemblies by electrically conductive masses to connect electrically conductive elements on support elements of each subassembly. A patterned layer of photo-imageable material may overlie a surface of one of the support elements and have openings with cross-sectional dimensions which are constant or monotonically increasing with height from the surface of that support element, where the masses extend through the openings and have dimensions defined thereby. An encapsulation can be formed by flowing an encapsulant into a space between the joined first and second subassemblies.
Public/Granted literature
- US20160079215A1 BATCH PROCESS FABRICATION OF PACKAGE-ON-PACKAGE MICROELECTRONIC ASSEMBLIES Public/Granted day:2016-03-17
Information query
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