Invention Grant
- Patent Title: Electronic device and manufacturing method therefor
- Patent Title (中): 电子设备及其制造方法
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Application No.: US14371073Application Date: 2013-01-10
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Publication No.: US09356252B2Publication Date: 2016-05-31
- Inventor: Yuuki Abe , Kenichi Nendai , Shuhei Yada , Kou Sugano
- Applicant: JOLED INC.
- Applicant Address: JP Tokyo
- Assignee: JOLED INC.
- Current Assignee: JOLED INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-007797 20120118
- International Application: PCT/JP2013/000060 WO 20130110
- International Announcement: WO2013/108598 WO 20130725
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L27/32

Abstract:
An electronic device includes a substrate, a first conductive layer disposed over the substrate, an organic insulating layer, including an organic material, disposed over the first conductive layer and having an aperture exposing a portion of the first conductive layer, a second conductive layer, which is metallic, covering a top face of the organic insulating layer, an inner circumferential face that faces the aperture in the organic insulating layer, and the exposed portion of the first conductive layer, and an intermediate layer that includes an oxide or a nitride, disposed only between the second conductive layer and the inner circumferential face that faces the aperture in the organic insulating layer. The first conductive layer and the second conductive layer are in contact at the bottom face of the aperture in the organic insulating layer.
Public/Granted literature
- US20150001517A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2015-01-01
Information query
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