Invention Grant
- Patent Title: MEMS package structure and method for fabricating the same
- Patent Title (中): MEMS封装结构及其制造方法
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Application No.: US14320562Application Date: 2014-06-30
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Publication No.: US09359190B2Publication Date: 2016-06-07
- Inventor: Chun-Hao Su
- Applicant: Himax Display, Inc.
- Applicant Address: TW Xinshi Dist., Tainan
- Assignee: Himax Display, Inc.
- Current Assignee: Himax Display, Inc.
- Current Assignee Address: TW Xinshi Dist., Tainan
- Agent Winston Hsu; Scott Margo
- Main IPC: B81B7/00
- IPC: B81B7/00
Abstract:
A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.
Public/Granted literature
- US20150375993A1 MEMS PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2015-12-31
Information query
