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公开(公告)号：US20160311678A1
公开(公告)日：2016-10-27
申请号：US15199604
申请日：2016-06-30
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
IPC: B81C1/00
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.
Abstract translation: 微机电系统（MEMS）封装结构的制造方法包括提供基座，其中所述基座包括凹部; 在所述凹部中设置芯片，其中所述芯片具有活性表面; 在所述凹部中的所述有源表面上设置MEMS器件，其中所述MEMS器件被第一盖覆盖，所述第一盖包括空腔，并且所述MEMS器件位于所述腔中; 在芯片和第一盖之间的周边间隙处设置密封剂以密封空腔; 将玻璃料放置在第二盖或基底上; 将第二盖设置在基座上，其中第二盖覆盖凹部，玻璃料布置在基座和第二盖之间; 并加热玻璃料以密封凹部。
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公开(公告)号：US09359190B2
公开(公告)日：2016-06-07
申请号：US14320562
申请日：2014-06-30
Applicant: Himax Display, Inc.
Inventor： Chun-Hao Su
IPC: B81B7/00
CPC classification number: B81B7/0038 , B81B2201/042
Abstract: A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.
Abstract translation: 公开了一种MEMS封装结构。 MEMS封装结构包括微机电系统（MEMS）结构上的第一玻璃衬底，粘附在第一玻璃衬底和MEMS结构之间的密封剂; 以及在第一玻璃基板，密封剂和MEMS结构的侧壁上的第一湿气屏障。
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公开(公告)号：US09500857B2
公开(公告)日：2016-11-22
申请号：US14449940
申请日：2014-08-01
Applicant: Himax Display, Inc.
Inventor： Hui-Lun Chen , Wei-Hsiao Chen , Chien-Tang Wang , Nan Liu , Roland V. Gelder , Chun-Hao Su
CPC classification number: G02B26/0841 , B81B3/0013 , B81B3/0021 , B81B2201/045
Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
Abstract translation: 微机电系统（MEMS）装置包括衬底和设置在衬底上的至少一个MEMS单元。 MEMS单元包括至少一个第一电极，至少一个第二电极，至少一个着陆元件和铰链层。 第一电极设置在基板上。 第二电极设置在基板上。 着陆元件设置在基板上。 铰链层包括铰链部分和至少一个悬臂部分。 铰链部分连接到第二电极。 悬臂部分连接到铰链部分。 悬臂部分具有第一开口和设置在第一开口中并连接到第一开口的至少一侧的至少一个弹簧。 当在第一电极和第二电极之间存在电压差时，铰链部分变形，弹簧因此接触着陆部件。
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公开(公告)号：US20150284241A1
公开(公告)日：2015-10-08
申请号：US14743678
申请日：2015-06-18
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.
Abstract translation: MEMS封装结构包括基座，MEMS器件，第一盖，第二盖和玻璃料。 底座包括一个凹槽。 MEMS器件设置在凹部中。 第一盖设置在凹部中并覆盖MEMS装置。 第二盖设置在基座上并覆盖凹部。 玻璃料布置在基部和第二盖之间。 MEMS封装结构包括基座，MEMS器件，第一盖，第二盖，第一金属框架和第一密封介质。 第一金属框架设置在第二盖周围，并且第二盖和第一金属框架共同设置在基座上并覆盖凹部。 第一密封介质设置在第一金属框架和基座之间。 进一步提供上述MEMS封装结构的制造方法。
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公开(公告)号：US09624097B2
公开(公告)日：2017-04-18
申请号：US15199604
申请日：2016-06-30
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.
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Patent Agency Ranking
公开(公告)号：US20150210538A1
公开(公告)日：2015-07-30
申请号：US14167819
申请日：2014-01-29
Applicant: Himax Display, Inc.
Inventor： Chun-Hao Su , Roland V. Gelder , Tore Nauta , Wei-Hsiao Chen
CPC classification number: G02B27/0006 , B81B7/0041 , B81C1/00269 , B81C2203/019 , G02B26/0833 , H01L2924/16235
Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.
Abstract translation: 提供了包括芯片，MEMS器件，盖子，密封剂和第一湿气屏障的MEMS封装结构。 芯片包括有源表面。 MEMS系统装置设置在有源表面上。 盖子被覆盖在芯片上并且包括凹部，其中MEMS器件在凹部中。 密封剂设置在芯片和盖之间以密封凹部，其中密封剂的厚度小于MEMS器件的高度。 第一个防潮层围绕芯片，密封剂和盖子密封。
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公开(公告)号：US09409766B2
公开(公告)日：2016-08-09
申请号：US14743678
申请日：2015-06-18
Applicant: Himax Display, Inc.
Inventor： Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
CPC classification number: B81C1/00269 , B81B7/0041 , B81B7/0058 , B81B2201/042 , B81C2203/019 , G02B26/0833 , G02B27/0006 , H01L2924/16195 , H01L2924/16235
Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.
Abstract translation: MEMS封装结构包括基座，MEMS器件，第一盖，第二盖和玻璃料。 底座包括一个凹槽。 MEMS器件设置在凹部中。 第一盖设置在凹部中并覆盖MEMS装置。 第二盖设置在基座上并覆盖凹部。 玻璃料布置在基部和第二盖之间。 MEMS封装结构包括基座，MEMS器件，第一盖，第二盖，第一金属框架和第一密封介质。 第一金属框架设置在第二盖周围，并且第二盖和第一金属框架共同设置在基座上并覆盖凹部。 第一密封介质设置在第一金属框架和基座之间。 进一步提供上述MEMS封装结构的制造方法。
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公开(公告)号：US20160033759A1
公开(公告)日：2016-02-04
申请号：US14449940
申请日：2014-08-01
Applicant: Himax Display, Inc.
Inventor： Hui-Lun Chen , Wei-Hsiao Chen , Chien-Tang Wang , Nan Liu , Roland V. Gelder , Chun-Hao Su
CPC classification number: G02B26/0841 , B81B3/0013 , B81B3/0021 , B81B2201/045
Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
Abstract translation: 微机电系统（MEMS）装置包括衬底和设置在衬底上的至少一个MEMS单元。 MEMS单元包括至少一个第一电极，至少一个第二电极，至少一个着陆元件和铰链层。 第一电极设置在基板上。 第二电极设置在基板上。 着陆元件设置在基板上。 铰链层包括铰链部分和至少一个悬臂部分。 铰链部分连接到第二电极。 悬臂部分连接到铰链部分。 悬臂部分具有第一开口和设置在第一开口中并连接到第一开口的至少一侧的至少一个弹簧。 当在第一电极和第二电极之间存在电压差时，铰链部分变形，弹簧因此接触着陆部件。
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公开(公告)号：US20150375993A1
公开(公告)日：2015-12-31
申请号：US14320562
申请日：2014-06-30
Applicant: Himax Display, Inc.
Inventor： Chun-Hao Su
CPC classification number: B81B7/0038 , B81B2201/042
Abstract: A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.
Abstract translation: 公开了一种MEMS封装结构。 MEMS封装结构包括微机电系统（MEMS）结构上的第一玻璃衬底，粘附在第一玻璃衬底和MEMS结构之间的密封剂; 以及在第一玻璃基板，密封剂和MEMS结构的侧壁上的第一湿气屏障。
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公开(公告)号：US09102513B1
公开(公告)日：2015-08-11
申请号：US14167819
申请日：2014-01-29
Applicant: Himax Display, Inc.
Inventor： Chun-Hao Su , Roland V. Gelder , Tore Nauta , Wei-Hsiao Chen
CPC classification number: G02B27/0006 , B81B7/0041 , B81C1/00269 , B81C2203/019 , G02B26/0833 , H01L2924/16235
Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.
Abstract translation: 提供了包括芯片，MEMS器件，盖子，密封剂和第一湿气屏障的MEMS封装结构。 芯片包括有源表面。 MEMS系统装置设置在有源表面上。 盖子被覆盖在芯片上并且包括凹部，其中MEMS器件在凹部中。 密封剂设置在芯片和盖之间以密封凹部，其中密封剂的厚度小于MEMS器件的高度。 第一个防潮层围绕芯片，密封剂和盖子密封。
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