发明授权
US09362234B2 Shielded device packages having antennas and related fabrication methods
有权
具有天线和相关制造方法的屏蔽器件封装
- 专利标题： Shielded device packages having antennas and related fabrication methods
- 专利标题（中）： 具有天线和相关制造方法的屏蔽器件封装
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申请号： US14149335申请日： 2014-01-07
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公开(公告)号： US09362234B2公开(公告)日： 2016-06-07
- 发明人: Eduard J. Pabst , Sergio P. Pacheco , Weng F. Yap
- 申请人： Eduard J. Pabst , Sergio P. Pacheco , Weng F. Yap
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/00 ; H01L21/768 ; H01L23/31 ; H01L23/00 ; H01L23/66 ; H01L23/498 ; H01L23/538 ; H01L21/56
摘要：
Shielded device packages and related fabrication methods are provided. An exemplary device package includes one or more electrical components, a molding compound overlying the one or more electrical components, a conductive interconnect structure within the molding compound, a conductive frame structure laterally surrounding the one or more electrical components and the interconnect structure, and a shielding structure overlying the one or more electrical components. The shielding structure is electrically connected to the frame structure and at least a portion of the molding compound resides between the shielding structure and the one or more electrical components.
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