Invention Grant
- Patent Title: Buried fin contact structures on FinFET semiconductor devices
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Application No.: US14817628Application Date: 2015-08-04
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Publication No.: US09362403B2Publication Date: 2016-06-07
- Inventor: Ruilong Xie , Ryan Ryoung-Han Kim , William J. Taylor, Jr.
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L27/088 ; H01L29/06 ; H01L29/417

Abstract:
A method includes forming a raised isolation structure with a recess above a substrate, forming a gate structure above the fin, forming a plurality of spaced-apart buried fin contact structures within the recess that have an outer perimeter surface that contacts at least a portion of an interior perimeter surface of the recess and forming at least one source/drain contact structure for each of the buried fin contact structures. One device includes a plurality of spaced-apart buried fin contact structures positioned within a recess in a raised isolation structure on opposite sides of a gate structure. The upper surface of each of the buried fin contact structures is positioned below an upper surface of the raised isolation structure and an outer perimeter surface of each of the buried fin contact structures contacts at least a portion of an interior perimeter surface of the recess.
Public/Granted literature
- US20150340452A1 Buried fin contact structures on FinFET semiconductor devices Public/Granted day:2015-11-26
Information query
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