Invention Grant
- Patent Title: Single chip signal splitting carrier aggregation receiver architecture
- Patent Title (中): 单芯片信号分离载波聚合接收机架构
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Application No.: US13411444Application Date: 2012-03-02
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Publication No.: US09362958B2Publication Date: 2016-06-07
- Inventor: Prasad Srinivasa Siva Gudem , Gurkanwal Singh Sahota , Li-chung Chang , Christian Holenstein , Frederic Bossu
- Applicant: Prasad Srinivasa Siva Gudem , Gurkanwal Singh Sahota , Li-chung Chang , Christian Holenstein , Frederic Bossu
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agent James Gutierrez
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B7/04
Abstract:
A wireless communication device configured for receiving a multiple carrier signal is described. The wireless communication device includes a single-chip signal splitting carrier aggregation receiver architecture. The single-chip signal splitting carrier aggregation receiver architecture includes a primary antenna, a secondary antenna and a transceiver chip. The single-chip signal splitting carrier aggregation receiver architecture reuses a simultaneous hybrid dual receiver path.
Public/Granted literature
- US20130231064A1 SINGLE-CHIP SIGNAL SPLITTING CARRIER AGGREGATION RECEIVER ARCHITECTURE Public/Granted day:2013-09-05
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