Invention Grant
- Patent Title: Making a plurality of integrated circuit packages
- Patent Title (中): 制作多个集成电路封装
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Application No.: US14965052Application Date: 2015-12-10
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Publication No.: US09363901B2Publication Date: 2016-06-07
- Inventor: Wen Yu Lee , Steven Su
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H05K3/30 ; H01L21/56 ; H01L21/78
Abstract:
A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads.
Public/Granted literature
- US20160100490A1 MAKING A PLURALITY OF INTEGRATED CIRCUIT PACKAGES Public/Granted day:2016-04-07
Information query
IPC分类:
