Invention Grant
- Patent Title: Embedded heat spreader with electrical properties
- Patent Title (中): 嵌入式散热器具有电气特性
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Application No.: US14135991Application Date: 2013-12-20
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Publication No.: US09368425B2Publication Date: 2016-06-14
- Inventor: Richard S. Graf , Jay F. Leonard , David J. West , Charles H. Wilson
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts, Mlotkowski, Safran & Cole PC
- Agent Yuanmin Cai; Andrew M. Calderon
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L23/433 ; H01L23/64 ; H01L23/498 ; H01L23/00
Abstract:
Embodiments of the invention relate to incorporating one or more antennas or inductor coils into a semi-conductor package. A heat spreader or metal sheet is embedded in the package and stamped or otherwise patterned into a spiral or serpentine form. The pattern enables the spreader to function as an inductor or antenna when connected to a semiconductor chip in communication with a printed circuit board.
Public/Granted literature
- US20150179542A1 EMBEDDED HEAT SPREADER WITH ELECTRICAL PROPERTIES Public/Granted day:2015-06-25
Information query
IPC分类:
