公开(公告)号：US09754911B2

公开(公告)日：2017-09-05

申请号：US14875032

申请日：2015-10-05

Applicant: GLOBALFOUNDRIES Inc.

Inventor： David J. West ,  Charles H. Wilson ,  Richard S. Graf

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L21/768 ,  H01L21/48 ,  H01L21/60

CPC classification number: H01L24/17 ,  H01L21/4853 ,  H01L21/76885 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/15 ,  H01L24/16 ,  H01L24/90 ,  H01L2021/60022 ,  H01L2224/11505 ,  H01L2224/11552 ,  H01L2224/11901 ,  H01L2224/13005 ,  H01L2224/13026 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/1412 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14177 ,  H01L2224/15 ,  H01L2224/16113 ,  H01L2224/16168 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1712 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/11442

Abstract: Aspects of the present disclosure include integrated circuit (IC) structures with angled interconnect elements. An IC structure according to the present disclosure can include: an IC chip interconnect surface including a radially inner region positioned within a radially outer region; and a plurality of conductive pillars extending outward from the radially inner region of the IC chip interconnect surface, relative to a radial centerline axis of the radially inner region of the IC chip interconnect surface, wherein the radially inner region of the IC chip interconnect surface is free of conductive pillars thereon.

公开(公告)号：US20170098623A1

公开(公告)日：2017-04-06

申请号：US14875032

申请日：2015-10-05

Applicant: GLOBALFOUNDRIES Inc.

Inventor： David J. West ,  Charles H. Wilson ,  Richard S. Graf

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L21/4853 ,  H01L21/76885 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/15 ,  H01L24/16 ,  H01L24/90 ,  H01L2021/60022 ,  H01L2224/11505 ,  H01L2224/11552 ,  H01L2224/11901 ,  H01L2224/13005 ,  H01L2224/13026 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/1412 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14177 ,  H01L2224/15 ,  H01L2224/16113 ,  H01L2224/16168 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1712 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/11442

Abstract: Aspects of the present disclosure include integrated circuit (IC) structures with angled interconnect elements. An IC structure according to the present disclosure can include: an IC chip interconnect surface including a radially inner region positioned within a radially outer region; and a plurality of conductive pillars extending outward from the radially inner region of the IC chip interconnect surface, relative to a radial centerline axis of the radially inner region of the IC chip interconnect surface, wherein the radially inner region of the IC chip interconnect surface is free of conductive pillars thereon.

公开(公告)号：US09368425B2

公开(公告)日：2016-06-14

申请号：US14135991

申请日：2013-12-20

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Richard S. Graf ,  Jay F. Leonard ,  David J. West ,  Charles H. Wilson

IPC: H01L29/00 ,  H01L23/433 ,  H01L23/64 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4334 ,  H01L23/49816 ,  H01L23/645 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of the invention relate to incorporating one or more antennas or inductor coils into a semi-conductor package. A heat spreader or metal sheet is embedded in the package and stamped or otherwise patterned into a spiral or serpentine form. The pattern enables the spreader to function as an inductor or antenna when connected to a semiconductor chip in communication with a printed circuit board.

Abstract translation: 本发明的实施例涉及将一个或多个天线或电感线圈并入到半导体封装中。 散热器或金属片被包埋在包装中并冲压或以其它方式图案化成螺旋或蛇形形式。 当连接到与印刷电路板通信的半导体芯片时，该图案使得扩展器能够用作电感器或天线。