Invention Grant
- Patent Title: Grounded diode pack
- Patent Title (中): 接地二极管组合
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Application No.: US14466652Application Date: 2014-08-22
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Publication No.: US09370083B2Publication Date: 2016-06-14
- Inventor: Gregory Alan Rittmeyer , David S. Behling , Timothy R. Welch
- Applicant: HAMILTON SUNDSTRAND CORPORATION
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Snell & Wilmer, L.L.P.
- Main IPC: H05F3/02
- IPC: H05F3/02 ; H02K11/00 ; H02K11/04

Abstract:
The present disclosure relates to generators and their components. Specifically, a grounded diode pack is disclosed herein. A design to accommodate non-damaging dissipation static charge build-up is disclosed. Non-damaging dissipation of accumulated charge involves the provision of a suitable electrical path that will allow charges to flow to ground.
Public/Granted literature
- US20160057844A1 GROUNDED DIODE PACK Public/Granted day:2016-02-25
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