Invention Grant
- Patent Title: 360 degree hinge assembly for electronic devices
- Patent Title (中): 用于电子设备的360度铰链组件
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Application No.: US14498040Application Date: 2014-09-26
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Publication No.: US09371676B2Publication Date: 2016-06-21
- Inventor: David A. Rittenhouse
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: E05D3/06
- IPC: E05D3/06 ; E05D11/08 ; E05D3/12

Abstract:
In one example a hinge assembly for an electronic device comprises a linkage comprising a first bushing disposed at a first end of the linkage and a second bushing disposed at a second end of the bushing, a first shaft rotatable within the first bushing about a first axis, a second shaft rotatable within the second bushing about a second axis, and at least one compression element disposed on the first shaft, wherein the first shaft and the first bushing are threaded such that rotation of the first shaft within the first bushing induces lateral translation of the first shaft along the first axis. Other examples may be described.
Public/Granted literature
- US20160090766A1 360 DEGREE HINGE ASSEMBLY FOR ELECTRONIC DEVICES Public/Granted day:2016-03-31
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