Invention Grant
US09373572B2 Semiconductor package having etched foil capacitor integrated into leadframe
有权
具有集成到引线框架中的蚀刻箔电容器的半导体封装
- Patent Title: Semiconductor package having etched foil capacitor integrated into leadframe
- Patent Title (中): 具有集成到引线框架中的蚀刻箔电容器的半导体封装
-
Application No.: US14879622Application Date: 2015-10-09
-
Publication No.: US09373572B2Publication Date: 2016-06-21
- Inventor: Gregory E. Howard , Bernardo Gallegos , Rajiv Dunne , Darvin R. Edwards , Siva P. Gurrum , Manu J. Prakuzhy , Donald C. Abbott
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/495 ; H01L21/78 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
A packaged semiconductor device including a leadframe and a plurality of angularly shaped capacitors. The leadframe includes structures with surfaces and sidewalls. The angularly shaped capacitors are attached to surface portions of the leadframe structures. The angularly shaped capacitors have sidewalls coplanar with structure sidewalls. The angularly shaped capacitors includes a conductive material attached to the structure surface. The conductive material having pores covered by oxide and filled with conductive polymer. The angularly shaped capacitors topped by electrodes are made of a second metal.
Public/Granted literature
- US20160035655A1 Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe Public/Granted day:2016-02-04
Information query
IPC分类:
