发明授权
- 专利标题: Semiconductor packages and methods of forming the same
- 专利标题(中): 半导体封装及其形成方法
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申请号: US13935456申请日: 2013-07-03
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公开(公告)号: US09373574B2公开(公告)日: 2016-06-21
- 发明人: Ae-nee Jang , Young Lyong Kim , Jaegwon Jang
- 申请人: Ae-nee Jang , Young Lyong Kim , Jaegwon Jang
- 申请人地址: KR
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR
- 代理机构: Renaissance IP Law Group LLP
- 优先权: KR10-2012-0073430 20120705
- 主分类号: H01L23/13
- IPC分类号: H01L23/13 ; H01L23/498 ; H01L21/56 ; H01L23/00 ; H01L25/065
摘要:
Disclosed are semiconductor packages and methods of forming the same. In the semiconductor packages and the methods, a package substrate includes a hole not overlapped with semiconductor chips. Thus, a molding layer may be formed without a void.
公开/授权文献
- US20140008797A1 SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME 公开/授权日:2014-01-09