Invention Grant
US09373602B2 Wire structure and semiconductor device having the same, and method of manufacturing the wire structure
有权
线结构和具有相同的半导体器件，以及制造线结构的方法
- Patent Title: Wire structure and semiconductor device having the same, and method of manufacturing the wire structure
- Patent Title (中): 线结构和具有相同的半导体器件，以及制造线结构的方法
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Application No.: US14467597Application Date: 2014-08-25
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Publication No.: US09373602B2Publication Date: 2016-06-21
- Inventor: Eun-kyung Lee , Byoung-lyong Choi , Won-Jae Joo , Byung-Sung Kim , Jae-Hyun Lee , Jong-Woon Lee , Dong-Mok Whang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.,Sungkyunkwan University Foundation for Corporate Collaboration
- Current Assignee: Samsung Electronics Co., Ltd.,Sungkyunkwan University Foundation for Corporate Collaboration
- Current Assignee Address: KR Gyeonggi-do KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0104508 20130830
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01B1/04
Abstract:
According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.
Public/Granted literature
- US20150061161A1 WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING THE WIRE STRUCTURE Public/Granted day:2015-03-05
Information query
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