Invention Grant
- Patent Title: Semiconductor package with optical port
- Patent Title (中): 半导体封装带光口
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Application No.: US13719884Application Date: 2012-12-19
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Publication No.: US09374162B2Publication Date: 2016-06-21
- Inventor: Robert L. Sankman , Johanna M. Swan , Dmitri E. Nikonov , Raseong Kim
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Forefront IP Lawgroup, PLLC
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H04B10/25 ; G02B6/43 ; H04B10/80
Abstract:
Described herein are technologies related to a semiconductor package that is installed in a portable device for data communications. More particularly, the semiconductor package that contains a memory, a digital logic chip, and an optical port in a single module or mold is described.
Public/Granted literature
- US20140169801A1 SEMICONDUCTOR PACKAGE WITH OPTICAL PORT Public/Granted day:2014-06-19
Information query
