Invention Grant
- Patent Title: FinFET structures having silicon germanium and silicon fins
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Application No.: US14672157Application Date: 2015-03-28
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Publication No.: US09378948B2Publication Date: 2016-06-28
- Inventor: Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Alexander Reznicek
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Mlotkowski Safran & Cole P.C.
- Agent Yuanmin Cai; Andrews M. Calderon
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/8238 ; H01L21/8234 ; H01L29/66 ; H01L27/12 ; H01L21/02 ; H01L27/088 ; H01L21/324 ; H01L21/84 ; H01L29/06 ; H01L29/16 ; H01L29/161 ; H01L29/167

Abstract:
A finned structure is fabricated using a bulk silicon substrate having a carbon doped epitaxial silicon layer. A pFET region of the structure includes silicon germanium fins. Such fins are formed by annealing the structure to mix a germanium containing layer with an adjoining crystalline silicon layer. The structure further includes an nFET region including silicon fins formed from the crystalline silicon layer. The germanium containing layer in the nFET region is removed to create a space beneath the crystalline silicon layer in the nFET region. An insulating material is provided within the space. The pFET and nFET regions are electrically isolated by a shallow trench isolation region.
Public/Granted literature
- US20150206744A1 FINFET STRUCTURES HAVING SILICON GERMANIUM AND SILICON FINS Public/Granted day:2015-07-23
Information query
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