Invention Grant
US09378984B2 Packaging a semiconductor device having wires with polymerized insulator skin
有权
包装具有聚合的绝缘体皮肤的导线的半导体器件
- Patent Title: Packaging a semiconductor device having wires with polymerized insulator skin
- Patent Title (中): 包装具有聚合的绝缘体皮肤的导线的半导体器件
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Application No.: US14520406Application Date: 2014-10-22
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Publication No.: US09378984B2Publication Date: 2016-06-28
- Inventor: Rongwei Zhang , Abram Castro
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L23/29 ; B29C45/14 ; B29C45/00 ; H01L23/00

Abstract:
A chip is attached to a substrate with wires spanning from the chip to the substrate is loaded in a heated cavity of a mold. The wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound. A pressure chamber of the mold is loaded with a solid pellet of a packaging material including a polymerizable resin. The chamber is connected to the cavity. The vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners before filling the mold cavity, wherein the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.
Public/Granted literature
- US20150037938A1 PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSULATOR SKIN Public/Granted day:2015-02-05
Information query
IPC分类: