Invention Grant
- Patent Title: Ion implantation method and ion implantation apparatus
- Patent Title (中): 离子注入法和离子注入装置
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Application No.: US14013862Application Date: 2013-08-29
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Publication No.: US09379030B2Publication Date: 2016-06-28
- Inventor: Shiro Ninomiya , Tadanobu Kagawa , Toshio Yumiyama , Akira Funai , Takashi Kuroda
- Applicant: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best and Friedrich
- Priority: JP2012-192420 20120831
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01J37/08 ; C23C14/48 ; H01J37/304 ; H01J37/317

Abstract:
Provided is an ion implantation method of transporting ions generated by an ion source to a wafer and implanting the ions into the wafer by irradiating an ion beam on the wafer, including, during the ion implantation into the wafer, using a plurality of detection units which can detect an event having a possibility of discharge and determining a state of the ion beam based on existence of detected event having a possibility of discharge and a degree of influence of the event on the ion beam.
Public/Granted literature
- US20140065737A1 ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS Public/Granted day:2014-03-06
Information query
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