Invention Grant
- Patent Title: Method of making a QFN package
- Patent Title (中): 制造QFN封装的方法
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Application No.: US14535939Application Date: 2014-11-07
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Publication No.: US09379087B2Publication Date: 2016-06-28
- Inventor: Dan Okamoto
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L23/31 ; G03F7/20
Abstract:
A method of making a flat no lead package including attaching a first plurality of leads in spaced apart relationship in a predetermined pattern on a tape and attaching a first die to the tape at a predetermined position within the predetermined lead pattern.
Public/Granted literature
- US20160133599A1 QFN Package Public/Granted day:2016-05-12
Information query
IPC分类:
