Invention Grant
- Patent Title: Manufacturing method of heat dissipation assembly
- Patent Title (中): 散热组件的制造方法
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Application No.: US14279610Application Date: 2014-05-16
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Publication No.: US09381599B2Publication Date: 2016-07-05
- Inventor: Chi-Hsueh Yang , Ming-Chang Tsai , Wei-Han Chen , Hsiao-Fan Chang
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Guishan Dist., Taoyuan
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Guishan Dist., Taoyuan
- Agency: Rabin & Berdo, P.C.
- Priority: TW102146678A 20131217
- Main IPC: B23P15/26
- IPC: B23P15/26 ; F28D15/02 ; F28D15/04 ; H01L23/427 ; H01L21/48
Abstract:
A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.
Public/Granted literature
- US20150165572A1 MANUFACTURING METHOD OF HEAT DISSIPATION ASSEMBLY Public/Granted day:2015-06-18
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