Invention Grant
- Patent Title: Method of forming Fin-FET
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Application No.: US14018439Application Date: 2013-09-05
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Publication No.: US09385048B2Publication Date: 2016-07-05
- Inventor: Shih-Fang Hong , Chung-Yi Chiu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L27/088 ; H01L29/78 ; H01L21/8238 ; H01L21/84 ; H01L29/66

Abstract:
The present invention provides a method of forming Fin-FET. A substrate with an active region and a dummy region are defined thereon. A plurality of first fins and second fins are formed in the active region, and a plurality of dummy fins are formed in the dummy region and the active region. A first active region is provided in the active region. A revised first active region is formed by extending the first active region to cover at least one adjacent dummy fin. Next, a first dummy region is provided in the dummy region. A first mask layout is formed by combining the revised first active region and the first dummy region. A first patterned mask layer is formed by using the first mask layout. A first epitaxial process is performed for the first fins and the dummy fins exposed by the first patterned mask layer.
Public/Granted literature
- US20150064869A1 Method of forming Fin-FET Public/Granted day:2015-03-05
Information query
IPC分类: