发明授权
- 专利标题： Stacked semiconductor chips with thermal management
- 专利标题（中）： 堆叠的半导体芯片与热管理
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申请号： US12860156申请日： 2010-08-20
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公开(公告)号： US09385055B2公开(公告)日： 2016-07-05
- 发明人: Gamal Refai-Ahmed , Michael Z. Su , Bryan Black , Maxat Touzelbaev , Yizhang Yang
- 申请人： Gamal Refai-Ahmed , Michael Z. Su , Bryan Black , Maxat Touzelbaev , Yizhang Yang
- 申请人地址： CA Markham US CA Sunnyvale
- 专利权人： ATI Technologies ULC,Advanced Micro Devices, Inc.
- 当前专利权人： ATI Technologies ULC,Advanced Micro Devices, Inc.
- 当前专利权人地址： CA Markham US CA Sunnyvale
- 代理商 Timothy M. Honeycutt
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/04 ; H01L23/367 ; H01L23/42 ; H01L25/065 ; H01L21/56 ; H01L23/10 ; H01L23/498
摘要：
A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture.
公开/授权文献
- US20120043668A1 STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT 公开/授权日：2012-02-23