Invention Grant
- Patent Title: Apparatus, system, and method for wireless connection in integrated circuit packages
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Application No.: US14658743Application Date: 2015-03-16
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Publication No.: US09385094B2Publication Date: 2016-07-05
- Inventor: Jiamiao Tang , Henry Xu , Shinichi Sakamoto
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L23/522 ; H01L23/50 ; H01L25/18
Abstract:
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
Public/Granted literature
- US20150187713A1 APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES Public/Granted day:2015-07-02
Information query
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