Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14804819Application Date: 2015-07-21
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Publication No.: US09385230B2Publication Date: 2016-07-05
- Inventor: Akihiro Shimomura , Yutaka Akiyama , Saya Shimomura , Yasutaka Nakashiba
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-061474 20130325
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/808 ; H01L29/40 ; H01L29/739 ; H01L29/10 ; H01L29/06

Abstract:
A semiconductor device including a first conductor layer, a second conductor layer formed over the first conductor layer, a third conductor layer formed over the second conductor layer, a gate trench which passes through the third conductor layer and is formed in the second conductor layer, a first insulating film formed on an inner wall of the gate trench, a second insulating film formed on the inner wall of the gate trench, a first buried conductor layer formed in the gate trench, a gate electrode formed in the gate trench, a fourth conductor layer of the second conductivity type formed on a lower end of the first buried conductor layer and a lower end of the gate trench, and a fifth conduction layer of the first conductivity type formed over the third conductor layer. The first insulating film is thicker than the second insulating film.
Public/Granted literature
- US20150325696A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-11-12
Information query
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