Invention Grant
- Patent Title: Three-dimensional integrated structure comprising an antenna
- Patent Title (中): 包括天线的三维一体化结构
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Application No.: US13920237Application Date: 2013-06-18
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Publication No.: US09385424B2Publication Date: 2016-07-05
- Inventor: Pierre Bar , Laurent Dussopt , Jean-François Carpentier
- Applicant: STMicroelectronics S.A. , Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- Applicant Address: FR Montrouge FR Paris
- Assignee: STMicroelectronics SA,Commissariat A L'Energie Atomique et aux Energies Alternatives
- Current Assignee: STMicroelectronics SA,Commissariat A L'Energie Atomique et aux Energies Alternatives
- Current Assignee Address: FR Montrouge FR Paris
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1255719 20120619
- Main IPC: H01Q1/50
- IPC: H01Q1/50 ; H01L23/66 ; H01Q1/24 ; H01Q9/04 ; H01Q23/00 ; H01L23/552 ; H01L23/498 ; H01L23/00
Abstract:
The three-dimensional integrated structure including a support element, an interface device connected to the support element by first electrically conductive connection, an integrated circuit arranged between the support element and the interface device and connected to the interface device by second electrically conductive connection, a filler region between the second electrically conductive connection and between the interface device and the integrated circuit, and an antenna, having a radiating element in electromagnetic coupling with an excitation element through the interconnection of a slot, the antenna being distributed over the interface device and the integrated circuit.
Public/Granted literature
- US20130335297A1 THREE-DIMENSIONAL INTEGRATED STRUCTURE COMPRISING AN ANTENNA Public/Granted day:2013-12-19
Information query
