A microelectromechanical systems (MEMS) package includes a MEMS device and an integrated circuit (IC) device connected by a through silicon via (TSV). A conductive MEMS structure is arranged in a dielectric layer and includes a membrane region extending across a first volume arranged in the dielectric layer. A first substrate is bonded to a second substrate through the dielectric layer, where the MEMS device includes the second substrate. The TSV extends through the second substrate to electrically couple the MEMS device to the IC device. A third substrate is bonded to the second substrate to define a second volume between the second substrate and the third substrate, where the IC device includes the first or third substrate. A method for manufacturing the MEMS package is also provided.