Invention Grant
- Patent Title: Panel unpacking method and panel unpacking device
- Patent Title (中): 面板拆包方法和面板拆包装置
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Application No.: US13806818Application Date: 2012-12-01
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Publication No.: US09387946B2Publication Date: 2016-07-12
- Inventor: Guokun Yang , Chunhao Wu , Kunhsien Lin , Minghu Qi , Zhenhua Guo , Yongqiang Wang , Zenghong Chen , Chenyangzi Li , Zhiyou Shu , Weibing Yang
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201210484285 20121123
- International Application: PCT/CN2012/085705 WO 20121201
- International Announcement: WO2014/079098 WO 20140530
- Main IPC: B65B23/20
- IPC: B65B23/20 ; B65B69/00 ; B65G49/06 ; H01L21/683 ; H01L21/677

Abstract:
A panel unpacking method includes (1) providing a panel unpacking device, which includes a pickup device including a manipulator and suction cups mounted to the manipulator and a conveyance device including a main body, a mounting board mounted to the main body, pins mounted to the mounting board, and cushioning device installed on the pins; (2) moving the manipulator to approach the panel until the suction cups of the manipulator get into contact with the panel; (3) the suction cups sucking and holding the panel and the manipulator making a movement to lift up the panel; (4) the manipulator carrying the panel to approach the pins of the conveyance device until the panel gets into contact with the contact sections of the pins; and (5) the suction cups releasing the panel to allow the panel to be stably positioned on the pins of the conveyance device.
Public/Granted literature
- US20140144107A1 PANEL UNPACKING METHOD AND PANEL UNPACKING DEVICE Public/Granted day:2014-05-29
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