Invention Grant
- Patent Title: Method for detecting resistance of a photo resist layer
- Patent Title (中): 检测抗蚀剂层电阻的方法
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Application No.: US14434187Application Date: 2014-08-15
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Publication No.: US09389173B2Publication Date: 2016-07-12
- Inventor: Hui Tian
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Kinney & Lange, P.A.
- Priority: CN201410109564 20140324
- International Application: PCT/CN2014/084507 WO 20140815
- International Announcement: WO2015/143821 WO 20151001
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/027 ; G01N21/41 ; G01N21/21 ; H01L21/3105 ; H01L21/3115

Abstract:
The present disclosure provides a method for detecting resistance of a photo resist layer. The method includes: providing a silicon wafer and measuring a refractive index of a surface of the silicon wafer as an initial refractive index of the surface of the silicon wafer; forming photo resist layers with different thicknesses on the surface of the silicon wafer; performing ion-implantation on the photo resist layers by predetermined amounts; peeling off the photo resist layers from the surface of the silicon wafer; and testing the refractive indexes of different areas on the surface of the silicon wafer after the ion-implantation, on which the photo resist layers with different thicknesses are located and determining the resistance of the photo resist layers with different thicknesses in contrast to the initial refractive index before the ion-implantation.
Public/Granted literature
- US20160061722A1 METHOD FOR DETECTING RESISTANCE OF A PHOTO RESIST LAYER Public/Granted day:2016-03-03
Information query
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