Invention Grant
- Patent Title: Semiconductor memory device and semiconductor package
- Patent Title (中): 半导体存储器件和半导体封装
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Application No.: US14290088Application Date: 2014-05-29
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Publication No.: US09390784B2Publication Date: 2016-07-12
- Inventor: Min-hee Cho , Satoru Yamada , Sang-ho Shin , Sung-sam Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0069200 20130617
- Main IPC: G11C11/406
- IPC: G11C11/406 ; G11C7/04 ; G11C16/34

Abstract:
A semiconductor memory device includes: a memory unit including a first memory sub region including a first memory cell and a second memory sub region including a second memory cell; a temperature information obtaining unit that obtains temperature information; a temperature estimation unit that estimates a first temperature of the first memory sub region and a second temperature of the second memory sub region based on the temperature information; a first sub region control unit that controls the first memory sub region based on the first temperature; and a second sub region control unit that controls the second memory sub region based on the second temperature.
Public/Granted literature
- US20140369110A1 SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR PACKAGE Public/Granted day:2014-12-18
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