Invention Grant
- Patent Title: Electronic component, method of manufacturing the same, and mount structure of electronic component
- Patent Title (中): 电子部件及其制造方法以及电子部件的安装结构
-
Application No.: US14667928Application Date: 2015-03-25
-
Publication No.: US09390858B2Publication Date: 2016-07-12
- Inventor: Hiroshi Abe , Yoshiyuki Nomura , Junichi Saito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-077361 20140403; JP2014-077362 20140403; JP2014-077363 20140403; JP2014-077364 20140403
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01G4/224 ; H01G2/06 ; H01G4/232 ; H01G4/30 ; H05K3/34
Abstract:
An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.
Public/Granted literature
- US20150287532A1 ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND MOUNT STRUCTURE OF ELECTRONIC COMPONENT Public/Granted day:2015-10-08
Information query
