Invention Grant
- Patent Title: Multilayer ceramic electronic component, method of manufacturing the same, and board having the same mounted thereon
- Patent Title (中): 多层陶瓷电子部件及其制造方法以及安装在其上的板
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Application No.: US14332003Application Date: 2014-07-15
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Publication No.: US09390860B2Publication Date: 2016-07-12
- Inventor: Sim Chung Kang , Seung Hee Yoo , Kyung Pyo Hong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0166899 20131230
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/228 ; H01G4/30 ; H01G2/06 ; H01G4/232 ; H01G4/12 ; H05K1/18

Abstract:
A multilayer ceramic electronic component may include a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor containing carbon nanotubes, and a base resin. When the multilayer ceramic electronic component is heat-tested by raising a temperature of the multilayer ceramic electronic component from room temperature to about 900° C. at a rate of about 10° C./min, a weight of the multilayer ceramic electronic component decreases by about 0.33% to about 2.19%.
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