Invention Grant
US09390860B2 Multilayer ceramic electronic component, method of manufacturing the same, and board having the same mounted thereon 有权
多层陶瓷电子部件及其制造方法以及安装在其上的板

Multilayer ceramic electronic component, method of manufacturing the same, and board having the same mounted thereon
Abstract:
A multilayer ceramic electronic component may include a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor containing carbon nanotubes, and a base resin. When the multilayer ceramic electronic component is heat-tested by raising a temperature of the multilayer ceramic electronic component from room temperature to about 900° C. at a rate of about 10° C./min, a weight of the multilayer ceramic electronic component decreases by about 0.33% to about 2.19%.
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