Invention Grant
- Patent Title: Semiconductor structures including fluidic microchannels for cooling and related methods
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Application No.: US14642196Application Date: 2015-03-09
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Publication No.: US09391011B2Publication Date: 2016-07-12
- Inventor: Mariam Sadaka
- Applicant: Soitec
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L23/498 ; H01L23/473 ; B01L3/00 ; H01L21/20 ; H01L23/367 ; H01L23/46 ; H01L27/06 ; H01L27/12 ; H01L23/00
Abstract:
Semiconductor structures are fabricated that include a semiconductor material bonded to a substrate with a layer of dielectric material between the semiconductor material and the substrate. At least one fluidic microchannel extends in a lateral direction through the layer of dielectric material between the semiconductor material and the substrate. The at least one fluidic microchannel includes at least one laterally extending section having a transverse cross-sectional shape entirely surrounded by the layer of dielectric material.
Public/Granted literature
- US20150179639A1 SEMICONDUCTOR STRUCTURES INCLUDING FLUIDIC MICROCHANNELS FOR COOLING AND RELATED METHODS Public/Granted day:2015-06-25
Information query
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