A manufacturing method of an electronic device simplifies the process by performing a patterning process by using an imprinting technology. An electronic device manufactured by the manufacturing method is also disclosed. In one embodiment, the electronic device includes a substrate provided to have a dented portion and a non-dented portion, a gate electrode located at and in direct contact with the dented portion of the substrate, a source electrode and a drain electrode located at the non-dented portion of the substrate, and a semiconductor layer located on the gate electrode and in contact with the source electrode and the drain electrode. The gate electrode, the source electrode, and the drain electrode are formed of at least one of molybdenum, tungsten, copper, aluminum, titanium, an alloy thereof, nanowire, graphene, carbon nanotube, indium tin oxide, indium zinc oxide and combinations thereof.