Invention Grant
US09391370B2 Antenna feed integrated on multi-layer PCB 有权
天线馈电集成在多层PCB上

Antenna feed integrated on multi-layer PCB
Abstract:
A transmitter includes apparatus for integrating the antenna feed into a multilayer PCB. The apparatus includes an antenna element disposed over the multilayer PCB having slot openings that substantially overlap and that enable an RF signal to be coupled from a printed transmission line located on one of the multilayer PCB conductive layers. The multilayer PCB board hosts at least one transceiver unit and a baseband unit such that the antenna feed, transceiver and baseband units are integrated on a single multilayer PCB board without degradation of antenna bandwidth and efficiency.
Public/Granted literature
Information query
Patent Agency Ranking
0/0