Invention Grant
- Patent Title: Antenna feed integrated on multi-layer PCB
- Patent Title (中): 天线馈电集成在多层PCB上
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Application No.: US14752531Application Date: 2015-06-26
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Publication No.: US09391370B2Publication Date: 2016-07-12
- Inventor: Ioannis Tzanidis , Robert Monroe
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H01Q9/18 ; H01Q1/50 ; H01Q1/48

Abstract:
A transmitter includes apparatus for integrating the antenna feed into a multilayer PCB. The apparatus includes an antenna element disposed over the multilayer PCB having slot openings that substantially overlap and that enable an RF signal to be coupled from a printed transmission line located on one of the multilayer PCB conductive layers. The multilayer PCB board hosts at least one transceiver unit and a baseband unit such that the antenna feed, transceiver and baseband units are integrated on a single multilayer PCB board without degradation of antenna bandwidth and efficiency.
Public/Granted literature
- US20150381229A1 ANTENNA FEED INTEGRATED ON MULTI-LAYER PCB Public/Granted day:2015-12-31
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