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US09396827B2 Cu—Ti based copper alloy sheet material and method for producing the same, and electric current carrying component 有权
Cu-Ti系铜合金板材及其制造方法以及电流承载部件

Cu—Ti based copper alloy sheet material and method for producing the same, and electric current carrying component
摘要：
A Cu—Ti based copper alloy sheet material contains, in mass %, from 2.0 to 5.0% of Ti, from 0 to 1.5% Ni, from 0 to 1.0% Co, from 0 to 0.5% Fe, from 0 to 1.2% Sn, from 0 to 2.0% Zn, from 0 to 1.0% Mg, from 0 to 1.0% Zr, from 0 to 1.0% Al, from 0 to 1.0% Si, from 0 to 0.1% P, from 0 to 0.05% B, from 0 to 1.0% Cr, from 0 to 1.0% Mn, and from 0 to 1.0% V, the balance substantially being Cu. The sheet material has a metallic texture wherein in a cross section perpendicular to a sheet thickness direction, a maximum width of a grain boundary reaction type precipitate is not more than 500 nm, and a density of a granular precipitate having a diameter of 100 nm or more is not more than 105 number/mm2.
摘要（中）：

Cu-Ti系铜合金板材以质量％计含有2.0％〜5.0％的Ti，0〜1.5％的Ni，0〜1.0％的Co，0〜0.5％的Fe，0〜1.2％的Sn ，0〜2.0％的Zn，0〜1.0％的Mg，0〜1.0％的Zr，0〜1.0％的Al，0〜1.0％的Si，0〜0.1％的P，0〜0.05％的B， 0至1.0％的Cr，0至1.0％的Mn和0至1.0％的V，余量基本上为Cu。 片材具有金属结构，其中在垂直于片材厚度方向的截面中，晶界反应型沉淀物的最大宽度不大于500nm，直径为100nm的粒状沉淀物的密度或 更多不超过105个/ mm2。

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