Invention Grant
- Patent Title: Integration of heat spreader for beol thermal management
- Patent Title (中): 整流散热器，用于beol热管理
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Application No.: US14499216Application Date: 2014-09-28
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Publication No.: US09397023B2Publication Date: 2016-07-19
- Inventor: Archana Venugopal , Marie Denison , Luigi Colombo , Sameer Pendharkar
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Daniel Chan; Frank D. Cimino
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/373 ; H01L23/532 ; H01L23/522 ; H01L23/528 ; H01L21/768 ; H01L21/48 ; H01L21/02
Abstract:
A microelectronic device includes a heat spreader layer on an electrode of a component and a metal interconnect on the heat spreader layer. The heat spreader layer is disposed above a top surface of a substrate of the semiconductor device. The heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
Public/Granted literature
- US20160093551A1 INTEGRATION OF HEAT SPREADER FOR BEOL THERMAL MANAGEMENT Public/Granted day:2016-03-31
Information query
IPC分类:
