Invention Grant
- Patent Title: Molding packaging material, and molded case
- Patent Title (中): 成型包装材料和模制盒
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Application No.: US14302449Application Date: 2014-06-12
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Publication No.: US09397321B2Publication Date: 2016-07-19
- Inventor: Zeng Kaibin , Susumu Takada
- Applicant: Showa Denko Packaging Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Showa Denko Packaging Co., Ltd.
- Current Assignee: Showa Denko Packaging Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Keating and Bennett, LLP
- Priority: JP2013-126577 20130617; JP2014-67677 20140328
- Main IPC: H01M2/02
- IPC: H01M2/02 ; B32B7/12 ; B32B15/08 ; B65D1/34 ; B65D1/40 ; B32B15/20 ; B32B27/36 ; B32B27/40

Abstract:
A molding packaging material includes a heat resistant resin layer as an outer layer, a metal foil layer, and a first adhesive agent layer arranged there between. The first adhesive agent layer is constituted by an adhesive agent containing a two-part curing type polyester polyurethane resin made of a polyester resin as a main ingredient and a multifunctional isocyanate compound as a curing agent. The polyester resin is made from dicarboxylic acid and dialcohol, the dicarboxylic acid contains aliphatic carboxylic acid whose number of methylene of a methylene chain is an even number and aromatic carboxylic acid, and a content rate of the aromatic carboxylic acid to a total amount of aliphatic carboxylic acid and aromatic carboxylic acid is 40 to 80 mol %. The polyester resin is 8,000 to 25,000 in number average molecular weight (Mn) and 15,000 to 50,000 in weight average molecular weight (Mw), and a ratio thereof (Mw/Mn) is 1.3 to 2.5.
Public/Granted literature
- US20140370368A1 MOLDING PACKAGING MATERIAL, AND MOLDED CASE Public/Granted day:2014-12-18
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