Invention Grant
- Patent Title: Through chip coupling for signal transport
- Patent Title (中): 通过芯片耦合进行信号传输
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Application No.: US12946072Application Date: 2010-11-15
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Publication No.: US09397729B2Publication Date: 2016-07-19
- Inventor: Tzu-Jin Yeh , Hsieh-Hung Hsieh , Jun-De Jin , Ming Hsien Tsai , Chewn-Pu Jou , Fu-Lung Hsueh
- Applicant: Tzu-Jin Yeh , Hsieh-Hung Hsieh , Jun-De Jin , Ming Hsien Tsai , Chewn-Pu Jou , Fu-Lung Hsueh
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H04B5/00
- IPC: H04B5/00

Abstract:
Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.
Public/Granted literature
- US20120122395A1 THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT Public/Granted day:2012-05-17
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