Invention Grant
- Patent Title: Audio extension module
- Patent Title (中): 音频扩展模块
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Application No.: US14319169Application Date: 2014-06-30
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Publication No.: US09398360B2Publication Date: 2016-07-19
- Inventor: Mikyung Kim , Heewon Kwon , Kangheui Cha , Byungmu Huh
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2013-0080494 20130709
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04N5/64 ; H04N21/418 ; H04N21/81
Abstract:
Provided is an audio extension module including: a body that is configured to include a first cover that is covered with an image display device and a second cover that is fixed to a wall; an audio output unit that is configured to be built into the body and that is configured to be formed in such a manner as to receive an audio signal from the image display device and to output the audio signal; and a frame that is configured to cover a gap that is formed between the image display device and the body and that is configured to be removably combined with the body in such a manner as to enclose a border of the body.
Public/Granted literature
- US20150016650A1 AUDIO EXTENSION MODULE Public/Granted day:2015-01-15
Information query
