Invention Grant
- Patent Title: Electromagnetic shielding composite
- Patent Title (中): 电磁屏蔽复合材料
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Application No.: US13461006Application Date: 2012-05-01
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Publication No.: US09398733B2Publication Date: 2016-07-19
- Inventor: Cheng-Hsien Lin , Yao-Wen Bai , Wen-Chin Lee , Rui Zhang , Kai-Li Jiang , Chen Feng
- Applicant: Cheng-Hsien Lin , Yao-Wen Bai , Wen-Chin Lee , Rui Zhang , Kai-Li Jiang , Chen Feng
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: TW96137493A 20071005
- Main IPC: H05K9/00
- IPC: H05K9/00 ; B29C70/88 ; B29K105/16
Abstract:
An electromagnetic shielding composite includes a polymer and a carbon nanotube film structure. The carbon nanotube structure includes a number of carbon nanotubes disposed in the polymer. The number of carbon nanotubes are parallel with each other.
Public/Granted literature
- US20120237721A1 ELECTROMAGNETIC SHIELDING COMPOSITE Public/Granted day:2012-09-20
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